Contents Info

MCM-L BGA 모듈의 전기적 변수 및 잡음 특성 해석 = Electrical Parameters and Noise Characteristics Analysis of a MCM-L BGA Module

서명/저자: MCM-L BGA 모듈의 전기적 변수 및 잡음 특성 해석 = Electrical Parameters and Noise Characteristics Analysis of a MCM-L BGA Module / 최순신

초록/해제: 요약 :We extracted electrical parameters and analyzed noise characteristics of a MCM-L BGA module in this paper. In order to make a MCM-L module of a pentium chip and four 64K×18bit Burst SRAM bare chips we routed the 50㎜×50㎜ 8 layers MCM-L substrate according to the design rule of line width/pitch = 100㎛/250㎛. For the electrical parameters, we divided circuit elements into the components of conductor types which are wires, via holes, BGA balls etc. we analyzed the electrical characteristics of the MCM-L BGA module with the simulation tools of SPICE and XNS. We have found that the pentium chip module has 6㎊ of capacitance, 25nH of inductance and 65Ω of characteristic impedance on the avarage. The simulation analysis has shown that the average signal delay was 0.5ns and the maximum crosstalk noise was 281㎷. We realized that the MCM-L module was adequate for a high speed module of requiring the signal delay of less than 1㎱.