내용보기

Solder ball 전이 방법으로 형성된 MCM-L BGA 특성 = The Characteristics of MCM-L BGA Fabricated Solder Ball Transfer Method

서명/저자: Solder ball 전이 방법으로 형성된 MCM-L BGA 특성 = The Characteristics of MCM-L BGA Fabricated Solder Ball Transfer Method / 최순신 저

초록/해제: 요약 :We fabricated MCM-L BGA substrate using solder ball transfer method and presented its mechanical and electrical characteristics. In order to make pentium BGA module of 0.8㎜ pad size and 1.5㎜ pad pitch, we formed and aligned solder balls(Pb/Sn) in the solder wells of Al substrate with screen printing technique, and then transferred to BGA pad with wetting difference of Al and BGA pad at solder melting temperature. We could vary the solder ball volume by controlling the size of solder wells and improved alignment stability because the balls are formed in the wells. To test bonding reliability, we made mechanical pull test and obtained 100% good results. For electrical characteristic of BGA solder ball, we simulated the electrical parasitic parameters by subarea method and measured with a TDR(Time Domain Reflectometry) equipment. We have found that self capacitance of BGA solder ball is 73.3fF and self inductance is 149.1pH, whose values were reduced to 37% and 80% of the value of QFP package structures.